发明名称 VAPOR DEPOSITION APPARATUS, AND VAPOR DEPOSITION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an innovative vapor deposition apparatus, which can vapor-deposit, even if an evaporation mask 2 is small-sized, a vapor-deposited film of a film-forming pattern by the evaporation mask on a large substrate 4 in a wide range by relatively moving the substrate with a space from the evaporation mask, can maintain the evaporation mask 2 at a constant temperature by sufficiently suppressing the temperature rise of the evaporation mask, and thus can perform accurate vapor deposition while preventing thermal deformation of the evaporation mask. <P>SOLUTION: In the deposition apparatus, the substrate 4 and the evaporation mask 2 are disposed with a space therebetween, a mask holder 6 is disposed between the substrate 4 and an evaporation source 1, the mask holder constituting a scatter limiting section with a limiting opening 5. The evaporation mask 2 is attached to the mask holder 6 by bonding. The mask holder 6 includes a temperature control mechanism 9 that maintains the temperature of the evaporation mask 2. The substrate 4 is relatively moved to the evaporation mask 2, whereby a vapor-deposited film of an accurate film forming pattern can be formed in a range wider than the evaporation mask 2. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012167309(A) 申请公布日期 2012.09.06
申请号 JP20110027900 申请日期 2011.02.10
申请人 CANON TOKKI CORP 发明人
分类号 C23C14/24;H01L51/50;H05B33/10 主分类号 C23C14/24
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