| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board exhibiting excellent yield. <P>SOLUTION: The manufacturing method of a printed wiring board comprises: a step of separating a carrier base material from a laminate sheet where a copper foil with a carrier base material (copper foil layer 104) is laminated on at least one surface 30 of an insulation layer 102, a step of forming a metal layer 115 thicker than the copper foil layer 104 entirely or selectively on the copper foil layer 104, and a step of obtaining a pattern of a conductive circuit 119 composed of the copper foil layer 104 and the metal layer 115 by etching at least the copper foil layer 104. In the step of obtaining the conductive circuit 119, Rp on one surface 30 of an insulation layer 102 is 4.5 μm or less, and Rku is 2.1 or more, when measured according to JIS B0601. <P>COPYRIGHT: (C)2012,JPO&INPIT |
