发明名称 |
HEAT RELAY, HEAT SWITCH, HEATING/COOLING DEVICE, HEAT CYCLE INJECTION MOLDING DEVICE, AND HEAT CYCLE INJECTION MOLDING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat relay that facilitates switching modes of heating and cooling. <P>SOLUTION: This heat relay includes a first wickless heat pipe and a second wickless heat pipe respectively having first ends and second ends, both of the first ends of the first and second wickless heat pipes configure a connection end connected with the same heat transfer object, and heat transfer mode is switched by simultaneously reversing a relative position in the gravitational direction of the first end and the second end of the first wickless heat pipe, and a relative position in the gravitational direction of the first end and the second end of the second wickless heat pipe. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012167900(A) |
申请公布日期 |
2012.09.06 |
申请号 |
JP20110031068 |
申请日期 |
2011.02.16 |
申请人 |
JAPAN AVIATION ELECTRONICS INDUSTRY LTD |
发明人 |
FUKUDA TAKUMA |
分类号 |
F28D15/02;B29C45/73 |
主分类号 |
F28D15/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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