发明名称 HEAT RELAY, HEAT SWITCH, HEATING/COOLING DEVICE, HEAT CYCLE INJECTION MOLDING DEVICE, AND HEAT CYCLE INJECTION MOLDING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat relay that facilitates switching modes of heating and cooling. <P>SOLUTION: This heat relay includes a first wickless heat pipe and a second wickless heat pipe respectively having first ends and second ends, both of the first ends of the first and second wickless heat pipes configure a connection end connected with the same heat transfer object, and heat transfer mode is switched by simultaneously reversing a relative position in the gravitational direction of the first end and the second end of the first wickless heat pipe, and a relative position in the gravitational direction of the first end and the second end of the second wickless heat pipe. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012167900(A) 申请公布日期 2012.09.06
申请号 JP20110031068 申请日期 2011.02.16
申请人 JAPAN AVIATION ELECTRONICS INDUSTRY LTD 发明人 FUKUDA TAKUMA
分类号 F28D15/02;B29C45/73 主分类号 F28D15/02
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