发明名称 ABRASIVE COMPOSITION AND POLISHING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a chemical-mechanical abrasive composition capable of simultaneously polishing a barrier film and an insulating film at a high speed, while maintaining planarity by suppressing dishing and erosion. <P>SOLUTION: A chemical-mechanical abrasive composition contains a 7-13C dicarboxylic acid, an oxidant, abrasive grains, and water. Preferably, the abrasive composition has a value of pH 2-4 or 8-12. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012169649(A) 申请公布日期 2012.09.06
申请号 JP20120089629 申请日期 2012.04.10
申请人 SHOWA DENKO KK 发明人 NISHIOKA AYAKO;ITO YUJI;SHIMAZU YOSHITOMO
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
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