发明名称 PREPREG, LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a prepreg that has excellent impregnation properties of a thermosetting resin composition into a woven fabric while maintaining various characteristics which the prepreg has. <P>SOLUTION: The prepreg 40 is obtained by impregnating a woven fabric comprised of strands with a resin composition. In the prepreg, silica particles are present in the strands. Thus, the prepreg having excellent impregnation properties of the resin composition into the woven fabric can be obtained. Also a metal-clad laminate using the prepreg and further a printed wiring board and a semiconductor device using them can be obtained. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012167256(A) 申请公布日期 2012.09.06
申请号 JP20120009112 申请日期 2012.01.19
申请人 SUMITOMO BAKELITE CO LTD 发明人 DAITO NORIYUKI
分类号 C08J5/04;H01L23/14 主分类号 C08J5/04
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