| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a wiring board of such a structure that the resistance component and the inductance component of a signal line and a GND electrode of a capacitor structure can be minimized. <P>SOLUTION: The semiconductor device has a capacitor structure 2 where an outer conductor 2a constituting a shield wire concentrically is arranged around a central conductor 2c constituting a part of a signal line with a dielectric 2b interposed therebetween. With regard to the central conductor 2c of each capacitor structure 2 provided, respectively, in two through holes 3, each central conductor 2c is connected electrically with an upper surface interconnection 5 on the surface side of a wiring board, and connected electrically with the central conductor 2c of another capacitor structure 2 via a first lower surface interconnection 6 on the rear surface. With regard to the outer conductor 2a of each capacitor structure 2, the outer conductor 2a is connected electrically while being covered with a second lower surface interconnection 7 formed uniformly and entirely on the rear surface side of the wiring board. <P>COPYRIGHT: (C)2012,JPO&INPIT |
