| 摘要 |
<p>Disclosed is a circuit board that improves visibility of an alignment mark. An FPC (50) alignment mark is formed by an opaque metallic film when manufacturing a board module that electrically connects a touch-panel (20) and the FPC (50), so visibility is high. With that, if the touch-panel (20) alignment mark (25) is also formed by an opaque metallic film, the alignment mark (25) visibility also becomes higher. Positioning with the touch-panel (20) and FPC (50) is easier and can be implemented with high precision by positioning using these high-visibility alignment marks. This results in increased yield of a board module, and eliminates a need for modification of an alignment apparatus that is used for positioning, so a board module manufacturing cost is reduced.</p> |
