| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer adhesive sheet which can be manufactured in low cost and can reduce the chipping during dicing. SOLUTION: The wafer adhesive sheet is composed of a base film and an adhesive layer formed on the base film, and its loss coefficient (at 23°C, frequency 600-700 Hz), which is measured by a center vibration method in a working condition that 10 adhesive sheets are laminated on one surface of a bare wafer with a thickness of 350μm and are formed in size 130 mm×20 mm, is 0.07 or more. COPYRIGHT: (C)2008,JPO&INPIT |
