发明名称 |
METHOD OF DEPOSITING COPPER IN LEAD-FREE SOLDER AND METHOD OF RECOVERING TIN |
摘要 |
<p>The purpose of the present invention is to separate excess coppers leached out in a lead-free solder bath and recover tin with high efficiency. An element X for forming a (CuX) 6 Sn 5 compound between copper and tin in molten lead-free solders is added to separate out a (CuX) 6 Sn 5 compound. Tin is recovered by binding the (CuX) 6 Sn 5 compound by passing thereof through a multi-perforated plate, further generating swirling currents to precipitate and separate the bound (CuX) 6 Sn 5 compounds and removing thereof.</p> |
申请公布号 |
EP1908853(B1) |
申请公布日期 |
2012.09.05 |
申请号 |
EP20060781546 |
申请日期 |
2006.07.25 |
申请人 |
NIHON SUPERIOR SHA CO., LTD |
发明人 |
NISHIMURA, TETSURO |
分类号 |
C22B25/08;C22B9/02;C22B9/10;H05K3/34 |
主分类号 |
C22B25/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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