| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipater that can efficiently transfer heat from a semiconductor module to a heat sink, thus dissipating heat. SOLUTION: A heat dissipater 17 uses a rectangular or elliptical semiconductor module 11 and holes 15a and 16a prepared at both ends of the semiconductor module 11 in a longitudinal direction to screw up a heat sink 12 by use of fitting and fixing screws 13 and 14 for heat dissipation, wherein the central part is folded up so that a graphite sheet 21 where a thick portion 21a is prepared is sandwiched between the semiconductor module 11 and the heat sink 12, thus obtaining excellent thermal coupling by a very easy-to-use and industrially simple method to efficiently dissipate heat. COPYRIGHT: (C)2009,JPO&INPIT |
