Electronic device housing

摘要

An electronic device housing includes a substrate and a metallic coating formed on the substrate. The substrate has a surface roughness of less than 60 nm. The metallic coating includes a plurality of first layers and a plurality of second layers. Each one of the first layers and each one of the second layers are alternately deposited on each other. The first layer and the second layer may be respectively tantalum pentoxide layer and silicon dioxide layer or may be respectively niobium pentoxide layer and zirconium dioxide layer.