INTERCONNECTION STRUCTURE THROUGH SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND DEVICE PACKAGE HAVING INTERCONNECTION STRUCTURE THROUGH SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: An interconnection structure through a substrate, a manufacturing method thereof, a device package having the same, and a manufacturing method for the device package are provided to reduce structure size by applying a reflow process to a via hole formed by etching a first substrate. CONSTITUTION: The center of a first substrate(100) has a recessed shape from a surface of an edge area. A first photo resist pattern is formed on the first substrate. A second substrate(200) is arranged on an recessed area of the first substrate. The second substrate has a through structure of having a predetermined pattern. A via plug(230) is formed passing through both sides of the second substrate.