发明名称 MOLD AND RESIN SEALING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a mold capable of preventing the tear of a release film as far as possible. <P>SOLUTION: The mold has a clamper 18 having a storage hole 16 formed in the mold opening/closing direction and a diameter-expanded hole 17 continuing to the storage hole 16 and a cavity block 20 stored in the storage hole 16 of the clamper 18, wherein a cavity recessed part 24 is formed in a space defined by the bottom surface 20a of the cavity block 20, a stepped wall surface 16a and the inner wall surface 17a of the diameter-expanded hole 17 as a cavity surface and a suction hole 40 communicating with the cavity recessed part 24 to suck the release film 38 supplied along the cavity recessed part 24 to the cavity recessed part 24 surface is formed. In the mold, a projected peripheral part 50 projected in the cavity recessed part 24 inside direction to make the depth of the cavity recessed part 24 shallower is disposed in the peripheral edge part of the bottom surface 20a of the cavity block 20. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012162013(A) 申请公布日期 2012.08.30
申请号 JP20110024717 申请日期 2011.02.08
申请人 APIC YAMADA CORP 发明人 TAKAHASHI YUICHI;MORIMURA MASAHIRO;HORIGUCHI TOMOAKI;MAEKAWA MASANORI
分类号 B29C33/12;B29C33/30;B29C45/14;B29C45/34;H01L21/56 主分类号 B29C33/12
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