| 摘要 |
Multilayered adhesive films that include a support layer, a first adhesive layer on or over the support layer and a second adhesive layer abutting the first adhesive layer, are provided. Of the abutting surfaces of the first and second adhesive layers, the first adhesive layer has a first profile and/or the second adhesive layer has a second profile. The first and/or second profiles are each independently selected such that the peel strength between the first and second adhesive layers is reduced relative to the comparative peel strength of a comparative multilayered adhesive film that is free of the first and second profiles. The multilayered adhesive films of the present invention may be used as dicing die attach films. Also provided is an assembly that includes a separate article (e.g., a silicon wafer) adhered to the multilayered adhesive film of the present invention. |
