发明名称 |
ATTACHMENT FOR SUBSTRATES HAVING DIFFERENT DIAMETERS, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SUBSTRATE OR SEMICONDUCTOR DEVICE |
摘要 |
A downsized substrate may be housed in a substrate accommodation vessel (FOUP) constituting a transfer system corresponding to a large diameter substrate. An attachment includes an upper plate and a lower plate supported by a first support groove that can support an 8-inch wafer, and holding columns installed at the upper plate and the lower plate and including a second support groove that can support a 2-inch wafer (if necessary, via a wafer holder and a holder member). Accordingly, the 2-inch wafer can be housed in a pod corresponding to the 8-inch wafer, and the pod, which is a transfer system, can be standardized to reduce cost of a semiconductor manufacturing apparatus. In addition, a distance from each gas supply nozzle to the wafer can be increased to sufficiently mix reactive gases before arrival at the wafer and improve film-forming precision to the wafer.
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申请公布号 |
US2012216743(A1) |
申请公布日期 |
2012.08.30 |
申请号 |
US201213407225 |
申请日期 |
2012.02.28 |
申请人 |
ITOH TAKESHI;TANAKA AKINORI;HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
ITOH TAKESHI;TANAKA AKINORI |
分类号 |
H01L21/205;C30B25/02;F16M13/00 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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