发明名称 MULTILAYER WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can reduce power supply impedance at an antiresonant frequency while keeping the power supply impedance at a resonant frequency low. <P>SOLUTION: Between a power source and a ground of an IC 50 mounted on a multilayer wiring board 1, one or more (two in Fig. 1) high ESR capacitors 70 each having an ESL of 1 nH or less and an ESR of no fewer than 1.5 &Omega; nor more than 20 &Omega;, and one or more (two in Fig. 1) low ESR capacitors 60 each having an ESL of 1 nH or less and an ESR of 100 m&Omega; or less are connected in parallel. The multilayer wiring board 1 can reduce impedance at an antiresonant frequency less than half (equivalent of -6 dB noise reduction) in comparison with the case provided with only low ESR capacitors 60, while keeping power supply impedance at a resonant frequency low. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012164817(A) 申请公布日期 2012.08.30
申请号 JP20110024170 申请日期 2011.02.07
申请人 MURATA MFG CO LTD;RENESAS ELECTRONICS CORP 发明人 YAMANAGA ISAO;ICHIMURA TAKASHI;AZUMA TAKAHIRO;AKIMOTO TETSUYA;KARIYAZAKI SHUICHI;SHIRAI WATARU;TSUKUDA TATSUAKI
分类号 H05K3/46;H01L23/12;H05K1/02 主分类号 H05K3/46
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