ADHESIVE SHEET FOR SEMICONDUCTOR, SEMICONDUCTOR WAFER USING THE SAME, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet for a semiconductor; which has a function as a dicing tape such as a retention capacity of a semiconductor in a dicing process and adhesion to a wafer ring in transportation or expansion; which is capable of easy pickup; which represents excellent thermal fluidity and connection reliability when a semiconductor element and a support member or semiconductor elements are bonded; and which can be easily separated from the wafer ring after use.

SOLUTION: An adhesive sheet of the present invention comprises: a base material (b) having a storage elastic modulus at 25°C of 50-1000 MPa; and an adhesive layer (a) including at least a thermoplastic resin and a thermosetting resin, having a thickness of not greater than 40 μm and laminated on the base material (b). A peel strength between the adhesive layer (a) and the base material (b) is 30-200 mN/cm.

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