| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method and a semiconductor device which can more easily achieve downsizing. <P>SOLUTION: A semiconductor device A5 provided by the present invention comprises a plurality of terminals 43, a first semiconductor chip 23, a second semiconductor chip 24 provided on the first semiconductor chip 23, a third semiconductor chip 25 provided on the second semiconductor chip 24, and an encapsulation resin 1 covering the first semiconductor chip 23, the second semiconductor chip 24, the third semiconductor chip 25 and the plurality of terminals 43. The plurality of terminals 43 include the terminals connected with the first semiconductor chip 23, the terminals connected with the second semiconductor chip 24 and the terminals connected with the third semiconductor chip 25. Bottom faces 43a in a thickness direction of the plurality of terminals 43 are exposed on the encapsulation resin 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
