发明名称 |
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE |
摘要 |
<P>PROBLEM TO BE SOLVED: To resolve problems that, although a GaN-based semiconductor is epitaxially grown on a (111)-oriented silicon substrate, since a difference between a lattice constant of GaN and a lattice constant of a silicon (111) plane is as large as about 17%, dislocation more than 10<SP POS="POST">10</SP>cm<SP POS="POST">-2</SP>is introduced to the grown GaN, which causes increase in a leakage current of a transistor using GaN and reduction in mobility of the transistor. <P>SOLUTION: A semiconductor substrate has a silicon substrate and a nitride semiconductor layer epitaxially grown on a (150) plane of the silicon substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012164717(A) |
申请公布日期 |
2012.08.30 |
申请号 |
JP20110022086 |
申请日期 |
2011.02.03 |
申请人 |
ADVANCED POWER DEVICE RESEARCH ASSOCIATION |
发明人 |
IWAMI MASAYUKI;FURUKAWA TAKUYA |
分类号 |
H01L21/20;C23C16/34;H01L21/205;H01L21/336;H01L21/338;H01L29/47;H01L29/778;H01L29/786;H01L29/812;H01L29/872 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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