发明名称 |
Solver for modeling a multilayered integrated circuit with three-dimensional interconnects |
摘要 |
Systems and methods for modeling a multilayer integrated circuit include three-dimensional interconnect models in multilayered substrates for greater accuracy. Mesh models are used to resolve effects of nearby elements and grid models are used to resolve effects of far-away elements. Sidewall mesh elements of three-dimensional interconnects are projected onto parallel (or substantially parallel) grids between the top and bottom walls of the interconnects so that grid models can be used to resolve three-dimensional effects of interconnects in multilayered substrates. |
申请公布号 |
US8255849(B1) |
申请公布日期 |
2012.08.28 |
申请号 |
US20090423722 |
申请日期 |
2009.04.14 |
申请人 |
OKHMATOVSKI VLADIMIR;YUAN MENGTAO;PHELPS RODNEY;CADENCE DESIGN SYSTEMS, INC. |
发明人 |
OKHMATOVSKI VLADIMIR;YUAN MENGTAO;PHELPS RODNEY |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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