发明名称 Semiconductor device and manufacturing method for semiconductor device
摘要 There is provided a semiconductor device including: a SiC substrate; an AlGaN layer formed on the SiC substrate; a source electrode and a drain electrode formed on the AlGaN layer so as to be spaced from each other; a first insulation film formed between the source electrode and the drain electrode and having a band-like opening parallel to the drain electrode and the source electrode; a gate electrode formed at the opening in the first insulation film; a second insulation film formed on the first insulation film in such a manner as to cover a surface of the gate electrode; and a source field plate electrode which is formed on the second insulation film and the source electrode and an end portion of which on the drain electrode side is spaced from the second insulation film, thereby suppressing degradation in device performance.
申请公布号 US8253169(B2) 申请公布日期 2012.08.28
申请号 US20090554423 申请日期 2009.09.04
申请人 KAWASAKI HISAO;KABUSHIKI KAISHA TOSHIBA 发明人 KAWASAKI HISAO
分类号 H01L29/66 主分类号 H01L29/66
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