| 摘要 |
The invention relates to a mould part for applying in a device for encapsulating electronic components mounted on a carrier, comprising: at least one mould cavity recessed into a contact side, a contact surface at least partially enclosing the mould cavity for medium-tight connection to the carrier of the electronic component, a feed channel for encapsulating material recessed into the contact surface and connecting to the mould cavity, a first outlet channel for gas, and an extraction space recessed into the contact surface. The invention also relates to a device for encapsulating electronic components mounted on a carrier and to a method for encapsulating electronic components mounted on a carrier. |
