| 摘要 |
<p>PURPOSE: A substrate for manufacturing a semiconductor package and a semiconductor package using the same are provided to increase the number of terminals for electrically connecting to an upper package by densely forming an input-output pad on the entire surface of a cavity substrate. CONSTITUTION: A lower substrate(10) forms a semiconductor chip mounting area(12) on the center of the upper side. A conductive pattern(14) is formed on the outer side of the semiconductor chip mounting area. A cavity substrate(20) is composed of a horizontal substrate(22) and a vertical substrate(24). A plurality of an input-output pad(26) are formed on the entire surface of the upper side of the horizontal substrate. A conductive adhesive unit(30) connects the conductive pattern exposed to the upper side of the lower substrate with a conductive pattern(28) exposed to the lower side of the vertical substrate.</p> |
