发明名称 |
SEMICONDUCTOR APPARATUS, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD |
摘要 |
A semiconductor apparatus includes: a first sheet-like member having a light receiving surface of an imaging device and a first connection terminal disposed thereon, the imaging device generating an image by receiving incident light from a light collecting section for collecting external light disposed thereon; a second sheet-like member having a second connection terminal to be connected to the first connection terminal provided thereon; a conductive bonding portion made of a conductive material and bonded with the first connection terminal; and a bonding wire connecting the conductive bonding portion and the second connection terminal, wherein the bonding wire is disposed along the plane of the first sheet-like member such that reflected light from the bonding wire does not impinge on the light receiving surface. |
申请公布号 |
US2012211855(A1) |
申请公布日期 |
2012.08.23 |
申请号 |
US201213352776 |
申请日期 |
2012.01.18 |
申请人 |
SONY CORPORATION |
发明人 |
IWAFUCHI TOSHIAKI;SHIMIZU MASAHIKO |
分类号 |
H01L31/02;B23K31/02;B23K37/00 |
主分类号 |
H01L31/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|