WET ETCHING APPARATUS AND WET ETCHING METHOD

摘要

The objective of the present invention is to execute wet etching of the entire surface of a substrate as uniformly as possible. Provided is a wet etching apparatus (100) for executing wet etching to a substrate (110), and which is provided with spray nozzles (14) for spraying etching liquid to the substrate (110), and spray piping (10) onto which the spray nozzles (14) are mounted, and which is for supplying the etching liquid to the spray nozzles (14). The spray nozzles (14) are arranged above the substrate (110), and the substrate (110) comprises a circumferential edge section (122) along the outer edge (75) of the substrate (110), and a center section (121) not including the circumferential edge section (122). The spray nozzles (14) are not arranged at the circumferential edge section (122), but arranged at the center section (121) not including the circumferential edge section (122).