SEMICONDUCTOR MANUFACTURING APPARATUS MEMBER

摘要

A ceramic heater includes a disk-shaped ceramic plate and a shaft. The ceramic plate includes a wafer-placing surface. The shaft has a hollow shape and is bonded to a surface of the ceramic plate opposite to the wafer-placing surface. A thermocouple conduit is formed in the ceramic plate so as to extend from a central portion of the ceramic plate to a position which is short of an outer peripheral surface of the ceramic plate. A thermocouple guide having a pipe-like shape is attached to the back surface of the ceramic plate. A guide hole in the thermocouple guide is connected to a portion of the thermocouple conduit at the central portion of the ceramic plate. The guide hole is disposed so as to be inclined with respect to the direction in which the thermocouple conduit extends.