Semiconductor package for use in e.g. electronic system, has upper semiconductor device comprising conductive bumps that connect pads on upper surface of interposer to corresponding terminal on lower surface of device

摘要

The package (1) has an interposer (120) formed from a semiconductor material or a glass material and comprising pads (124) formed on its upper surface. A lower semiconductor chip (130) is attached at the interposer. An upper semiconductor device (200) has a lower surface on which terminals (270, 280) are formed. The device has conductive bumps with lower and upper sections arranged on the upper surface of the interposer and extending to the lower surface of the device. The bumps connect one of the pads to the corresponding terminal on the lower surface of the device. An independent claim is also included for a method for producing a semiconductor package.