| 摘要 |
The functional unit has semiconductor bodies (20, 21) comprising contact points connected with conductor paths (12, 13). A non-conductive casting material covers semiconductor chips (24, 25), and the bodies are arranged at bottom surface of a tub. Other conductor paths (14, 34) are arranged in the casting material. One of the latter paths is electrically connected to one of the former paths via feedthrough units, which are formed with bores filled with conductive material. Contact pads (56, 57, 59) of the chips are connected with contact surfaces of the latter conductor paths. The semiconductor bodies are made of plastic. An independent claim is also included for a method for manufacturing a three-dimensional functional unit. |
