| 摘要 |
PURPOSE: A power removing apparatus using a thermoelectric device of a semiconductor manufacturing apparatus is provided to improve manufacturing efficiency by preventing powder due to flowable gas in a pipe. CONSTITUTION: A cooling block(200) receives heat from a pipe(100) and discharges heat to the outside. A semiconductor device(300) absorbs and discharges heat transmitted from the pipe to the cooling block. A power source(400) supplies power to the semiconductor device. A heat sink absorbs heat discharged from the cooling block. A heat radiation fin(600) discharges heat stored in the heat sink. A temperature controller(700) controls an inner temperature of the pipe.
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