SEMICONDUCTOR DEVICE HAVING WARPAGE PREVENTION ADHESIVE PATTERN AND FABRICATING METHOD THE SAME

摘要

PURPOSE: A semiconductor device with a junction pattern for preventing a warpage and a manufacturing method thereof are provided to form various joints of semiconductor devices by electroless plating with a strip unit of a printed circuit board. CONSTITUTION: A first semiconductor device(100) includes an I/O terminal(20) which extends a function of a circuit pattern(13) of a semiconductor device. A top I/O pad(40) is formed on the upper side(11) of the first semiconductor device. A bottom I/O pad(60) is formed on the lower side(12) of the first semiconductor substrate. A second semiconductor device(200) is bonded to the first semiconductor device. A junction pattern(70A) for preventing the warpage is arranged in a space between the first semiconductor device and the second semiconductor device.