WIRING BOARD, MOLD, AND MANUFACTURING METHOD OF WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a wiring board which has a land part formed by filling a recessed pattern with a conductive material and particularly fills a wide (low aspect ratio) recessed pattern with the conductive material without having recesses at the land part, which achieves dimension stability and high reliability.

SOLUTION: A wiring board 1 of this invention includes a substrate 2 made of a resin material, a recessed pattern 3A (3) provided on one surface side of the substrate, and a conductor part formed by filling the recessed pattern with a conductive material 5. A bottom surface part of the recessed pattern has protrusions 4 which are formed by a resin material and are provided so as to form protruding shapes relative to the bottom surface part.

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