| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a connection structure in which the connection reliability of first and second connection target members is high and the conduction reliability between electrodes is also high. <P>SOLUTION: A connection structure 1 according to the invention comprises: a first connection target member 2 having an electrode 2b on its top surface 2a; a second connection target member 4 having an electrode 4b on its undersurface 4a; and a cured material layer 3 which is interposed between the top surface 2a of the first connection target member 2 and the undersurface 4b of the second connection target member 4 and which is formed by curing an adhesive agent. A fillet by the cured material layer 3 is formed in at least a part of the area outside of the outer peripheral side surface of the second connection target member 4. The cured material layer 3 includes a first cured material layer part 3a on the first connection target member 2 side and a second cured material layer part 3b on the second connection target member 4 side. The modulus of elasticity at 25°C of the first cured material layer part 3a is higher than the modulus of elasticity at 25°C of the second cured material layer part 3b. <P>COPYRIGHT: (C)2012,JPO&INPIT |
