| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in wiring board capable of reducing manufacture a burden for improved reliability and a method of manufacturing the same. <P>SOLUTION: The component built-in wiring board includes a wiring pattern, a component connected on the surface electrically and mechanically, and an insulating material layer stacked on the surface of the wiring pattern so as to embed the component. The insulating material layer includes a first insulating layer which is positioned to contact to the wiring pattern, and a second insulating layer stacked on the first insulating layer. The second insulating layer includes such insulating layer portion as an opening that penetrates the layer thickness direction to correspond to the position of the component is provided to surround the component, being away from the component. The first insulating layer has a layer thickness reaching a part of the height position of the component, as a layer thickness positioned from the surface of a wiring pattern as far as the second insulating layer, with an interlayer connection body being so provided as to be electrically conductive to the wiring pattern. A reinforcing material in the first insulating layer is present in an insulating resin of the first insulating layer without reaching the component region sideways. An insulating resin in the first insulating layer reaches the component region to tightly contact to the component. <P>COPYRIGHT: (C)2012,JPO&INPIT |
