ENCAPSULANT FOR LED AND MANUFACTURING METHOD THEREOF, LED USING THE ENCAPSULANT AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An encapsulant for a self light emitting device, a manufacturing method thereof, the self light emitting device using the encapsulant, and a manufacturing method thereof are provided to improve heat resistance by including polysilazane. CONSTITUTION: A polysilazane is a polymer type. The polysilazane is formed into a polymer in which nitrogen and silicon atoms are exclusively crossed. A fluorescent substance has one or more colors evenly distributed in the polysilazane. Green phosphor powder, red fluorescence powder, and yellow phosphor powder are prepared in a proportion of exciting light irradiated from self light emitting device(100) to white light. Optical acid powder is evenly distributed in the polysilazane with the fluorescent substance.