| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the lowering of an yield caused by the nozzle clogging of a head after being assembled with the other member, and to reduce costs by eliminating a gap between a dicing tape and a substrate at dicing, and suppressing, to the minimum, an effect that a chip intrudes into the gap between the substrate and the tape and becomes a foreign matter. <P>SOLUTION: In the method of manufacturing a droplet ejection head 50 containing the chip formed on the substrate 1, recessed pattern-4 side faces 41B, 41C which are formed so as to overlap with a dicing line 5 at the side of a tape pasting face 1A of the substrate to which the dicing tape 30 is pasted when applying dicing processing to the substrate are formed into inclined faces, and the chip is separately formed by being pasted with the dicing tape so that a space 40 does not remain in an interface between the tape pasting face 1A and the dicing tape 30. <P>COPYRIGHT: (C)2012,JPO&INPIT |
