| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition having a flux function not damaged by heating, and capable of electrically connecting a semiconductor chip, or the like, and a circuit board well, and to provide a semiconductor device, a multilayer circuit board and an electronic component using such a resin composition. <P>SOLUTION: The resin composition composing a resin composition layer having a flux function used in the solder joint surface of a first member contains a resin capable of crosslinking reaction, and a thermal acid generating agent which generates an acid by heating. Preferably, the thermal acid generating agent is one kind selected from a group consisting of an onium salt compound, a triazine derivative, an organic sulfonic acid condensed derivative, and an organic carboxylic acid condensed derivative. <P>COPYRIGHT: (C)2012,JPO&INPIT |
