| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for housing an electronic component and an electronic device therewith which suppress a stress generated at a recessed portion in which an external connecting conductor is formed. <P>SOLUTION: The package for housing an electronic component includes: an insulating base 4 comprising a substrate 2 having a mounting portion 1 for an electronic component 9 and a frame 3 attached so as to surround the mounting portion 1; a groove-shaped recessed portion 5 provided at a side surface or corner portion of the insulating base 4; a wiring conductor 6 led from around the mounting portion 1 of the insulating base 4 to an inner wall surface of the recessed portion 5; and an external connecting conductor 7 formed from a peripheral portion of a lower surface of the insulating base 4 to the inner wall surface of the recessed portion 5. The recessed portion 5 has a first recessed portion 5a provided to an upper surface of the frame 3 and a second recessed portion 5b provided under the first recessed portion 5a from the lower surface, and the second recessed portion 5b has in a plan view a central inner wall surface flush with a central inner wall surface of the first recessed portion 5a and both side inner wall surfaces set back inward of the insulating base 4 from both side inner wall surfaces of the first recessed portion 5a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
