| 发明名称 |
WATER-SOLUBLE RESIN COMPOSITION AND METHOD OF FORMING FINE PATTERNS USING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a water-soluble resin composition for forming fine photoresist patterns by efficiently reducing the size of a contact hole pattern of a photoresist in a semiconductor process. <P>SOLUTION: The water-soluble resin composition comprises a water-soluble polymer represented by (Formula 1) as specified, and a first water-soluble solvent, and is coated and heat-treated on a photoresist layer having a contact hole pattern formed, to reduce the size of the contact hole. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012155304(A) |
申请公布日期 |
2012.08.16 |
| 申请号 |
JP20110073283 |
申请日期 |
2011.03.29 |
| 申请人 |
KOREA KUMHO PETROCHEMICAL CO LTD |
发明人 |
PARK SANG WOOK;PARK SO-JUN;SEO DONG-CHUL |
| 分类号 |
G03F7/40;C08F32/00;H01L21/027 |
主分类号 |
G03F7/40 |
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