发明名称 SILVER POWDER AND METHOD FOR PRODUCTION THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide a silver powder that makes it possible to form a conductor free from blister and chip by being used for a paste and fired, and to provide a method for production thereof. <P>SOLUTION: The silver powder obtained by adding a reducing agent to an aqueous reaction system containing silver ions, reducing and depositing silver particles and then drying, is heat-treated at a temperature higher than 100&deg;C but lower than 400&deg;C, thus producing the silver powder which is &le;1.5% in the maximum thermal expansion coefficient at 50&deg;C to 800&deg;C, is free from exothermic peak when heated from 50&deg;C up to 800&deg;C, is &le;1.0% in ignition loss when ignited until a constant weight is achieved at 800&deg;C, is &ge;2 g/cm<SP POS="POST">3</SP>in tap density, and is &le;5 m<SP POS="POST">2</SP>/g in BET specific surface area. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012153979(A) 申请公布日期 2012.08.16
申请号 JP20120083476 申请日期 2012.04.02
申请人 DOWA HOLDINGS CO LTD 发明人 FUJINO TAKEAKI;OGI KOZO
分类号 B22F9/24;B22F1/00;H01B5/00;H01B13/00 主分类号 B22F9/24
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