发明名称 HONEYCOMB STRUCTURE
摘要 <p>A honeycomb structure includes: a honeycomb structural portion having porous partition walls functioning as fluid passages and separating and forming a plurality of cells extending from one end face to the other end face. The partition walls and the outer peripheral wall contain silicon carbide particles as a framework and silicon as a binder for binding the silicon carbide particles. The honeycomb structure has a partition walls thickness of 50 to 200 µm, a cell density of 40 to 150 cells/cm 2 , and an average particle diameter of the silicon carbide as a framework of 3 to 40 µm. The honeycomb structural portion has a volume resistivity of 1 to 40 ©cm at 400°C, and the volume resistivity of the electrode portion at 400°C is not more than 40% of the volume resistivity of the honeycomb structural portion at 400°C. The honeycomb structure has a volume resistivity within a predetermined range and functions as a heater, while serving as a catalyst carrier.</p>
申请公布号 EP2487146(A1) 申请公布日期 2012.08.15
申请号 EP20100822104 申请日期 2010.10.07
申请人 NGK INSULATORS, LTD. 发明人 NOGUCHI, YASUSHI;KANEDA, ATSUSHI;KAKITANI, MARIKO;OMIYA, YOSHIMASA
分类号 C04B38/00;B01D53/86;B01J35/00;B01J35/04;C04B35/565;C04B35/63;C04B111/00;F01N3/20;F01N3/24;F01N3/28;H05B3/03;H05B3/14 主分类号 C04B38/00
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