| 发明名称 |
Method for manufacturing a circuit assembly |
| 摘要 |
<p>The method involves providing a substrate (12), and arranging a flexible connecting element (16) on the substrate. An insulating material (18) is inserted between the flexible connecting element and substrate to produce the circuit device (10).</p> |
| 申请公布号 |
EP2463900(A3) |
申请公布日期 |
2012.08.15 |
| 申请号 |
EP20110185592 |
申请日期 |
2011.10.18 |
| 申请人 |
SEMIKRON ELEKTRONIK GMBH & CO. KG |
发明人 |
DR. BRAML, HEIKO;GOEBL, CHRISTIAN |
| 分类号 |
H01L23/31;H01L21/60;H01L23/29 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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