发明名称 Adhesive resin composition and laminate
摘要 An adhesive resin composition excellent in adhesiveness and heat resistance thereof, film-forming properties, and film quality and a laminate having an adhesive resin layer made of this adhesive resin composition are provided. The Composition is an adhesive resin composition comprising 10-99.5% by weight resin ingredient (A), 0.5-30% by weight another resin ingredient (unsaturated-carboxylic-acid-modified polypropylene), and 0-89.5% by weight still another resin ingredient (olefin resin). Resin ingredient (A): a product of successive propylene polymerization comprising 10-60% by weight (propylene homopolymer) component and 40-90% by weight (propylene/ethylene copolymer) component. The contents of room-temperature-xylene solubles derived from (a2), room-temperature-xylene insolubles derived from (a2), and room-temperature-xylene solubles derived from the same are 1-20% by weight, lower than 20% by weight, and 10-60% by weight, respectively, based on resin ingredient (A). The room-temperature-xylene solubles derived from (a2) have a content of α-olefins excluding propylene of 20% by weight or higher.
申请公布号 US8242036(B2) 申请公布日期 2012.08.14
申请号 US20060065049 申请日期 2006.09.01
申请人 IKEDA CHIKAKO;MITSUBISHI CHEMICAL CORPORATION 发明人 IKEDA CHIKAKO
分类号 B32B27/32;B32B27/12 主分类号 B32B27/32
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