发明名称 |
Method of fabricating stacked wire bonded semiconductor package with low profile bond line |
摘要 |
A method of fabricating a low profile semiconductor package is disclosed including at least first and second stacked semiconductor die mounted to a substrate. The first and/or second semiconductor die may be fabricated with a plurality of redistribution pads formed over and electrically coupled to a plurality of bond pads. After the semiconductor die are formed and diced from the wafer, the die may be mounted to the substrate using a low profile reverse wire bond according to the present invention. In particular, a wedge bond may be formed between the wire and the redistribution pad without having to use a second wire bond ball on the die bond pad as in conventional reverse ball bonding processes.
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申请公布号 |
US8241953(B2) |
申请公布日期 |
2012.08.14 |
申请号 |
US20080165340 |
申请日期 |
2008.06.30 |
申请人 |
SANDISK TECHNOLOGIES INC. |
发明人 |
TAKIAR HEM;BHAGATH SHRIKAR |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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