发明名称 |
Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor package |
摘要 |
A printed circuit board (PCB) includes a wire pattern that has a low processing cost and a high yield by simplifying the structure of the PCB and can increase the joining characteristics and reliability of minute bumps when a flip-chip bonding process is performed. The PCB includes a body resin layer having lower and upper surfaces, a wire pattern on or in one of the upper and lower surfaces of the body resin layer, at least one through-hole contact extending from the wire pattern through the body resin layer, and a solder resist on the upper and lower surfaces of the body resin layer, openings of the solder resist corresponding to at least one of a solder ball land and a bump land, the solder ball land and the bump land being configured to couple the PCB to a semiconductor chip. If the solder ball land is on the one-layer wire pattern, the bump land is on the through-hole contact, and if the bump land is on the wire pattern, the solder ball land is on the through-hole contact.
|
申请公布号 |
US8241968(B2) |
申请公布日期 |
2012.08.14 |
申请号 |
US20100938534 |
申请日期 |
2010.11.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE YONG-KWAN;PARK TAE-SUNG;KIM WON-KEUN |
分类号 |
H01L21/00;H01K3/00 |
主分类号 |
H01L21/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|