发明名称 |
Joint structure, joining method, wiring board and method for producing the same |
摘要 |
A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part. |
申请公布号 |
US8241760(B2) |
申请公布日期 |
2012.08.14 |
申请号 |
US20090440986 |
申请日期 |
2009.03.12 |
申请人 |
CHUMA TOSHIAKI;SUMITOMO BAKELITE COMPANY, LTD. |
发明人 |
CHUMA TOSHIAKI |
分类号 |
B32B15/04;B23K20/00;B32B15/20;H01R4/00;H01R4/02;H05K3/00 |
主分类号 |
B32B15/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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