发明名称 SUBSTRATE FOR PRINTED WIRING AND RESIN COMPOSITION USED THEREFOR
摘要 There are provided a substrate for printed wiring excellent in light transmission property, heat resistance, mechanical strength and resistance to thermal coloration; a printed wiring laminate; and a resin composition used to produce the substrate and the laminate. The substrate for printed wiring comprises an aromatic polyether-typed polymer having a glass transition temperature, as measured by differential scanning calorimetry (DSC, heating rate: 20° C./minute), of from 230° C. to 350° C.
申请公布号 US2012199383(A1) 申请公布日期 2012.08.09
申请号 US201013503023 申请日期 2010.10.20
申请人 OKANIWA MOTOKI;KIKUCHI TOSHIMITSU;UNO TAKAAKI;OKADA TAKASHI;JSR CORPORATION 发明人 OKANIWA MOTOKI;KIKUCHI TOSHIMITSU;UNO TAKAAKI;OKADA TAKASHI
分类号 H05K1/03;C08G65/38 主分类号 H05K1/03
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