ARRANGEMENT OF CARRIERS FOR OPTOELECTRONIC CHIPS

摘要

An arrangement of carriers (10) for optoelectronic chips (4) comprising - a base body (1) formed with a ceramic material, - a plurality of chip connection regions (2), and - a protection metallization (3), wherein - the base body (1) comprises a top surface (1a), a bottom surface (1c) and at least one side surface (1b) which connects the top surface (1a) with the bottom surface (1c), - the chip connection regions (2) are arranged on the top surface (1a) of the base body (2), - each chip connection regions (2) is configured to carry at least one optoelectronic chip (4), - the protection metallization (3) covers all side surfaces (1b) of the base body (1) is specified.