| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate for a suspension which facilitates bending processing. <P>SOLUTION: In the substrate for the suspension which includes a metal support substrate, a first insulating layer formed on the metal support substrate, a first wiring layer formed on the first insulating layer, a second insulating layer formed so as to cover the first wiring layer, a second wiring layer which is formed on the second insulating layer so as to overlap the first wiring layer in a plan view, and a cover layer formed so as to cover the second wiring layer, in a bending processing section, the cover layer has a notch portion. <P>COPYRIGHT: (C)2012,JPO&INPIT |
