发明名称 |
MAGNETRON SPUTTERING PROCESS |
摘要 |
<p>To control reactive magnetron sputtering process using a reactive gas or reactive gases the process overall pressure is regulated by means of the flow of the reactive gas or the reactive gases, respectively. Oscillations of the flow of the reactive gas or the reactive gases, respectively are determined and used as feedback to determine the process overall pressure.</p> |
申请公布号 |
WO2012104002(A1) |
申请公布日期 |
2012.08.09 |
申请号 |
WO2011EP74335 |
申请日期 |
2011.12.31 |
申请人 |
PIVOT A.S.;ZINDULKA, ONDREJ;JILEK, MOJMIR |
发明人 |
ZINDULKA, ONDREJ;JILEK, MOJMIR |
分类号 |
C23C14/00 |
主分类号 |
C23C14/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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