| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive comprising a photosensitive resin composition which has an excellent developability and in which the outgassing after the curing is enough decreased. <P>SOLUTION: The adhesive is used to bond an optional substrate or members mutually by heating/pressurizing for 1-60 seconds under the condition of the temperature of 130-180°C and the pressure of 0.1-1.5 MPa, and the adhesive comprises the photosensitive resin composition that includes: (A) a binder polymer having a carboxyl group; (B) a photopolymerizable compound; (C) a photopolymerization initiator; (D) an inorganic filler; and (E) a compound having a hetero ring. <P>COPYRIGHT: (C)2012,JPO&INPIT |
